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LMC6082IM Tech Specifications

Category Linear - Amplifiers - Special Purpose
Manufacturer National Semiconductor
Surface Mount YES
Number of Terminals 8Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description 0.150 INCH, PLASTIC, SOP-8
Moisture Sensitivity Levels 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Slew Rate-Nom 1.5 V/us
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.33.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 235
Number of Functions 2Functions
Terminal Pitch 1.27 mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Supply Current-Max 2 mA
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
Seated Height-Max 1.75 mm
Unity Gain BW-Nom 1300
Average Bias Current-Max (IIB) 0.000004 μA
Low-Offset NO
Frequency Compensation YES
Supply Voltage Limit-Max 16 V
Low-Bias YES
Micropower NO
Programmable Power NO
Input Offset Voltage-Max 1300 μV
Wideband NO
Power NO
Voltage Gain-Min 35000
Common-mode Reject Ratio-Min 63 dB
Slew Rate-Min 0.6 V/us
Length 4.9 mm
Width 3.9 mm
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LMC6082IM Documents

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