LMC6464BIMX/NOPB Tech Specifications

Category Linear - Amplifiers - Special Purpose
Manufacturer National Semiconductor
Surface Mount YES
Housing Material ABS
Number of Terminals 14Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description SOP, SOP14,.25
Common-mode Reject Ratio-Nom 74 dB
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Slew Rate-Nom 0.023 V/us
Supply Voltage-Nom (Vsup) 3 V
Gross Weight 21.20
Transport Packaging size/quantity 51*32*31/500
JESD-609 Code e3
ECCN Code EAR99
Type 37-pin D-SUB connector housing
Terminal Finish Matte Tin (Sn)
HTS Code 8542.33.00.01
Packing Method TAPE AND REEL
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 4Functions
Terminal Pitch 1.27 mm
Depth 53 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 14
JESD-30 Code R-PDSO-G14
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Supply Current-Max 0.07 mA
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
Seated Height-Max 1.75 mm
Unity Gain BW-Nom 50
Operating Temperature Range -55…+105°C
Average Bias Current-Max (IIB) 0.00001 μA
Low-Offset NO
Frequency Compensation YES
Supply Voltage Limit-Max 16 V
Low-Bias YES
Micropower YES
Bias Current-Max (IIB) @25C 0.00001 μA
Input Offset Voltage-Max 3000 μV
Common-mode Reject Ratio-Min 62 dB
Slew Rate-Min 0.008 V/us
Saturation Current 1
Length 8.65 mm
Height 24.1 mm
Width 69.3 mm
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