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LMC6482IM Tech Specifications

Category Linear - Amplifiers - Special Purpose
Manufacturer National Semiconductor
Surface Mount YES
Material aluminium
Number of Terminals 8Terminals
Transport packaging size/quantity 42*28*18.5/2000
Maximum current 24 A
Mounting hole size 6 mm
Solder hole diameter 2.5 mm
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description SO-8
Common-mode Reject Ratio-Nom 82 dB
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Slew Rate-Nom 1.3 V/us
Supply Voltage-Nom (Vsup) 5 V
Gross weight 700 g
Plate thickness 15mm
Mounting for back plate
Material finishing raw
Colour aluminium
Heatsink shape grilled
Type of heatsink extruded
JESD-609 Code e0
ECCN Code EAR99
Type instrument terminal (F), Ф4 mm
Terminal Finish Tin/Lead (Sn/Pb)
Color blue
HTS Code 8542.33.00.01
Packing Method RAIL
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 235
Number of Functions 2Functions
Terminal Pitch 1.27 mm
Depth 22 mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Supply Current-Max 1.9 mA
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
Seated Height-Max 1.75 mm
Unity Gain BW-Nom 1500
Average Bias Current-Max (IIB) 0.000004 μA
Low-Offset NO
Frequency Compensation YES
Supply Voltage Limit-Max 16 V
Low-Bias YES
Micropower YES
Input Offset Voltage-Max 3000 μV
Rated voltage 30 (AC/ DC) V
Voltage Gain-Min 10000
Common-mode Reject Ratio-Min 62 dB
2nd Connector Number of Positions Loaded universal
Slew Rate-Min 0.63 V/us
Saturation Current 1
Diameter 10 mm
Height 84mm
Width 130mm
Length 50mm
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