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BC846B,215 Tech Specifications
| Category | Transistors - Bipolar (BJT) - Single | |
| Manufacturer | Nexperia | |
| Factory Lead Time | 4 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Surface Mount | YES | |
| Number of Pins | 3Pins | |
| Transistor Element Material | SILICON | |
| Current-Collector (Ic) (Max) | 100mA | |
| Number of Elements | 1 Element | |
| Operating Temperature | 150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | Automotive, AEC-Q101 | |
| Published | 2011 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) |
| HTS Code | 8541.21.00.95 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Base Part Number | BC846 | |
| Pin Count | 3 | |
| Configuration | SINGLE | |
| Power Dissipation | 500mW | |
| Power - Max | 250mW | |
| Transistor Application | SWITCHING | |
| Polarity/Channel Type | NPN | |
| Transistor Type | NPN | |
| DC Current Gain (hFE) (Min) @ Ic, Vce | 200 @ 2mA 5V | |
| Current - Collector Cutoff (Max) | 15nA ICBO | |
| Vce Saturation (Max) @ Ib, Ic | 400mV @ 5mA, 100mA | |
| Voltage - Collector Emitter Breakdown (Max) | 65V | |
| Transition Frequency | 100MHz | |
| Frequency - Transition | 100MHz | |
| RoHS Status | ROHS3 Compliant |
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BC846B,215 Documents
Download datasheets and manufacturer documentation for BC846B,215
- PCN PackagingCarrier Tapes 31/Aug/2016 Lighter Reels 02/Jan/2014
- DatasheetsBC846B.215-Philips-datasheet-29749.pdf BC846B,215-Nexperia-datasheet-87580894.pdf BC846 Series BC846B,215-Nexperia-datasheet-12520503.pdf BC846B.215-Philips-datasheet-10979565.pdf BC846B,215-Nexperia-datasheet-116120539.pdf BC846B,215-Philips-datasheet-14064689.pdf BC846B.215-Philips-datasheet-118926.pdf
- PCN Design/SpecificationResin Hardener 02/Jul/2013
- RohsStatementNXP-Semiconductors-company-12.pdf
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