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BCV62,215 Tech Specifications
| Category | Transistors - Special Purpose | |
| Manufacturer | Nexperia | |
| Factory Lead Time | 4 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-253-4, TO-253AA | |
| Number of Pins | 4Pins | |
| Collector-Emitter Breakdown Voltage | -30V | |
| Number of Elements | 2 Elements | |
| Packaging | Tape & Reel (TR) | |
| Published | 2010 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 4Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -65°C | |
| Applications | Current Mirror | |
| Max Power Dissipation | 250mW | |
| Terminal Form | GULL WING | |
| Current Rating | 100mA |
| Frequency | 100MHz | |
| Base Part Number | BCV62 | |
| Pin Count | 4 | |
| Polarity | PNP | |
| Element Configuration | Dual | |
| Power Dissipation | 250mW | |
| Case Connection | COLLECTOR | |
| Forward Current | 200mA | |
| Gain Bandwidth Product | 100MHz | |
| Forward Voltage | 260mV | |
| Transistor Type | 2 PNP (Dual) Current Mirror | |
| Collector Emitter Voltage (VCEO) | 30V | |
| Max Collector Current | 100mA | |
| Max Repetitive Reverse Voltage (Vrrm) | 30V | |
| Transition Frequency | 100MHz | |
| Collector Base Voltage (VCBO) | 30V | |
| Emitter Base Voltage (VEBO) | 6V | |
| Max Forward Surge Current (Ifsm) | 600mA | |
| DC Current Gain-Min (hFE) | 100 | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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BCV62,215 Documents
Download datasheets and manufacturer documentation for BCV62,215
- PCN PackagingLogo 10/Dec/2016 Lighter Reels 02/Jan/2014
- DatasheetsBCV62,215-Nexperia-datasheet-82944409.pdf BCV62 BCV62,215-Nexperia-datasheet-9889360.pdf BCV62,215-Nexperia-datasheet-15206846.pdf BCV62,215-NXP-Semiconductors-datasheet-13691674.pdf BCV62,215-Nexperia-datasheet-8522872.pdf
- PCN Assembly/OriginMult Dev Assembly/Wafer 10/Apr/2019
- PCN Design/SpecificationResin Hardener 02/Jul/2013
- RohsStatementNXP-Semiconductors-company-12.pdf
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