NXP BF747
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BF747 Tech Specifications
| Category | Fixed Inductors | |
| Manufacturer | NXP | |
| Mounting Type | Surface Mount, MLCC | |
| Package / Case | 0402 (1005 Metric) | |
| Surface Mount | YES | |
| Package | Tape & Reel (TR) | |
| Mfr | Concord Components, Inc. | |
| Product Status | Active | |
| Voltage Rated | 6.3V | |
| Package Description | , | |
| Operating Temperature-Max | 150 °C | |
| Rohs Code | No | |
| Transition Frequency-Nom (fT) | 800 MHz | |
| Manufacturer Part Number | BF747 | |
| Manufacturer | Philips Semiconductors | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Risk Rank | 8.51 | |
| Operating Temperature | -25°C ~ 85°C | |
| Series | - | |
| Size / Dimension | 0.039 L x 0.020 W (1.00mm x 0.50mm) |
| Tolerance | -20%, +80% | |
| JESD-609 Code | e0 | |
| Temperature Coefficient | Y5V (F) | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Applications | General Purpose | |
| Capacitance | 1 µF | |
| Subcategory | Other Transistors | |
| Reach Compliance Code | unknown | |
| Failure Rate | - | |
| Lead Spacing | - | |
| Configuration | Single | |
| Lead Style | - | |
| Polarity/Channel Type | NPN | |
| Power Dissipation-Max (Abs) | 0.3 W | |
| Collector Current-Max (IC) | 0.05 A | |
| DC Current Gain-Min (hFE) | 40 | |
| Features | - | |
| Height Seated (Max) | - | |
| Thickness (Max) | - | |
| Ratings | - |
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