BLF4G20LS-110B Tech Specifications

Category Fixed Inductors
Manufacturer NXP
Mounting Type Panel Mount, VESA Mount
Surface Mount YES
Weight -
Number of Terminals 2Terminals
Transistor Element Material SILICON
Storage SSD, 256GB
Package Bulk
Mfr Siemens
Product Status Active
Operating Systems Supports Windows 10
Memory DDR4 (16GB Max Capacity)
Package Description FLATPACK, R-CDFP-F2
Package Style FLATPACK
Package Body Material CERAMIC, METAL-SEALED COFIRED
Operating Temperature-Max 150 °C
Rohs Code Yes
Manufacturer Part Number BLF4G20LS-110B
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Number of Elements 1 Element
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.8
Drain Current-Max (ID) 12 A
Operating Temperature 0°C ~ 50°C
Series SIMATIC
ECCN Code EAR99
Type Panel PC
Subcategory FET General Purpose Power
Voltage - Supply 24VDC
Terminal Position DUAL
Terminal Form FLAT
Ingress Protection IP40/IP65 - Dust Tight, Water Resistant
Reach Compliance Code unknown
Pin Count 2
JESD-30 Code R-CDFP-F2
Qualification Status Not Qualified
Approval Agency BSMI, CE, CSA, EAC, FCC, KC, RCM, UL
Configuration SINGLE
Operating Mode ENHANCEMENT MODE
Core Processor Intel® Atom® X6413E 3.9GHz
Case Connection SOURCE
Transistor Application AMPLIFIER
Polarity/Channel Type N-CHANNEL
Display Type 15 Touchscreen
Drain Current-Max (Abs) (ID) 12 A
DS Breakdown Voltage-Min 65 V
FET Technology METAL-OXIDE SEMICONDUCTOR
Expansion Type M.2
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
Features -
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