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BLF871 Tech Specifications

Category Fixed Inductors
Manufacturer NXP
Surface Mount YES
Number of Pins 3Pins
Number of Terminals 2Terminals
Transistor Element Material SILICON
RoHS Compliant
Package Description ROHS COMPLIANT, CERAMIC PACKAGE-2
Package Style FLANGE MOUNT
Package Body Material CERAMIC, METAL-SEALED COFIRED
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 200 °C
Rohs Code Yes
Manufacturer Part Number BLF871
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Number of Elements 1 Element
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.73
Packaging Bulk
Max Operating Temperature 150 °C
Min Operating Temperature -65 °C
Additional Feature HIGH RELIABILITY
Terminal Position DUAL
Terminal Form FLAT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code compliant
Frequency 1 GHz
Pin Count 2
JESD-30 Code R-CDFM-F2
Qualification Status Not Qualified
Configuration SINGLE
Element Configuration Single
Output Power 24 W
Transistor Application AMPLIFIER
Drain to Source Voltage (Vdss) 89 V
Polarity/Channel Type NPN
Continuous Drain Current (ID) 20 A
Gate to Source Voltage (Vgs) 13 V
Gain 22 dB
Drain to Source Breakdown Voltage 89 V
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
Collector-Base Capacitance-Max 1 pF
REACH SVHC No SVHC
Lead Free Lead Free
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