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BZB784-C12+115 Tech Specifications

Category Diodes - Zener - Arrays
Manufacturer NXP
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SC-70, SOT-323
Number of Pins 70Pins
Supplier Device Package SOT-323
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Blue Anodized
RoHS Compliant
Package Bulk
Impedance (Max) (Zzt) 25 Ohms
Mfr NXP USA Inc.
Product Status Active
Series pushPIN™
Operating Temperature -
Tolerance 5 %
Part Status Active
Type Top Mount
Max Operating Temperature 150 °C
Min Operating Temperature -65 °C
Max Power Dissipation 180 mW
Configuration 1 Pair Common Anode
Attachment Method Push Pin
Height Off Base (Height of Fin) 0.984 (25.00mm)
Thermal Resistance @ Forced Air Flow 4.24°C/W @ 100 LFM
Impedance 25 Ω
Element Configuration Common Anode
Current - Reverse Leakage @ Vr 100 nA @ 8 V
Power Dissipation 350 mW
Voltage - Forward (Vf) (Max) @ If 900 mV @ 10 mA
Power - Max 180 mW
Max Reverse Leakage Current 100 nA
Test Current 5 mA
Voltage - Zener (Nom) (Vz) 12 V
Zener Voltage 12.05 V
Voltage Tolerance 5 %
ESD Protection Yes
Thermal Resistance @ Natural --
Power Dissipation @ Temperature Rise --
Width 1.575 (40.00mm)
Length 1.575 (40.00mm)
Diameter --
Radiation Hardening No
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