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- BZB784-C5V6.115
NXP BZB784-C5V6.115 Zener Diode Arrays
350 mW 5.6 V
IN STOCK
: 3000
Min. : 1
Mult. : 1
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BZB784-C5V6.115 Tech Specifications
| Category | Diodes - Zener - Arrays | |
| Manufacturer | NXP | |
| Mount | Surface Mount | |
| Number of Pins | 3Pins | |
| Material | Aluminum | |
| Shape | Square, Fins | |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | |
| Material Finish | Blue Anodized | |
| RoHS | Compliant | |
| Series | pushPIN™ | |
| Tolerance | 5 % | |
| Part Status | Active | |
| Type | Top Mount | |
| Max Operating Temperature | 150 °C | |
| Min Operating Temperature | -65 °C | |
| Max Power Dissipation | 350 mW | |
| Working Voltage | 5.6 V | |
| Attachment Method | Push Pin |
| Height Off Base (Height of Fin) | 1.181 (30.00mm) | |
| Thermal Resistance @ Forced Air Flow | 2.99°C/W @ 100 LFM | |
| Impedance | 40 Ω | |
| Element Configuration | Common Anode | |
| Power Dissipation | 350 mW | |
| Max Reverse Leakage Current | 1 µA | |
| Test Current | 5 mA | |
| Forward Voltage | 900 mV | |
| Zener Voltage | 5.6 V | |
| Peak Reverse Current | 1 µA | |
| Voltage Tolerance | 5 % | |
| Thermal Resistance @ Natural | -- | |
| Power Dissipation @ Temperature Rise | -- | |
| Width | 1.772 (45.00mm) | |
| Length | 1.772 (45.00mm) | |
| Diameter | -- | |
| Radiation Hardening | No | |
| Lead Free | Lead Free |
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