BZB784-C8V2115 Tech Specifications

Category Diodes - Zener - Arrays
Manufacturer NXP
Mounting Type Surface Mount
Package / Case SC-70, SOT-323
Supplier Device Package SOT-323
Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Blue Anodized
Package Bulk
Impedance (Max) (Zzt) 15 Ohms
Mfr NXP USA Inc.
Product Status Active
Series pushPIN™
Operating Temperature -
Tolerance ±5%
Part Status Active
Type Top Mount
Configuration 1 Pair Common Anode
Attachment Method Push Pin
Height Off Base (Height of Fin) 0.590 (15.00mm)
Thermal Resistance @ Forced Air Flow 8.73°C/W @ 100 LFM
Current - Reverse Leakage @ Vr 700 nA @ 5 V
Voltage - Forward (Vf) (Max) @ If 900 mV @ 10 mA
Power - Max 180 mW
Voltage - Zener (Nom) (Vz) 8.2 V
Thermal Resistance @ Natural --
Power Dissipation @ Temperature Rise --
Width 1.378 (35.00mm)
Length 1.378 (35.00mm)
Diameter --
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