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LPC1225FBD64/321 Tech Specifications

Category Evaluation and Demonstration Boards and Kits
Manufacturer NXP
Mount Surface Mount
Surface Mount YES
Number of Pins 64Pins
Number of Terminals 64Terminals
Clock Frequency-Max 25 MHz
Ihs Manufacturer NXP SEMICONDUCTORS
Manufacturer NXP Semiconductors
Manufacturer Part Number LPC1225FBD64/321
Memory Types FLASH
Number of I/O Lines 55I/O Lines
Number of I/Os 55I/Os
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Description LFQFP,
Package Shape SQUARE
Package Style FLATPACK
Part Life Cycle Code Active
Part Package Code QFP
Risk Rank 5.7
RoHS Compliant
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Max Operating Temperature 85 °C
Min Operating Temperature -40 °C
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Frequency 30 MHz
Pin Count 64
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Operating Supply Voltage 3.3 V
Temperature Grade INDUSTRIAL
Max Supply Voltage 3.6 V
Min Supply Voltage 3 V
Memory Size 80 kB
Speed 45 MHz
RAM Size 8 kB
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Bit Size 32
Has ADC YES
DMA Channels YES
Data Bus Width 32 b
PWM Channels NO
DAC Channels NO
Seated Height-Max 1.6 mm
Number of Timers/Counters 4Timers/Counters
Core Architecture ARM
Max Frequency 30 MHz
Number of UART Channels 2UART Channels
Number of ADC Channels 8ADC Channels
ROM Programmability FLASH
Number of I2C Channels 1I2C Channel
Number of GPIO 55GPIOs
Number of SPI Channels 1SPI Channel
Height 1.45 mm
Length 10.1 mm
Width 10.1 mm
REACH SVHC No SVHC
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