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MC33FS4505LAER2 Tech Specifications

Category Specialized
Manufacturer NXP
Mounting Type Surface Mount
Housing Material Thermoplastic
Number of Positions or Pins (Grid) 478 (26 x 26)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy
Contact Finish Mating Gold
Factory Pack QuantityFactory Pack Quantity 2000
Part # Aliases 935420063528
Manufacturer NXP
Brand NXP Semiconductors
Operating Temperature --
Series --
Packaging --
Part Status Obsolete
Termination Solder
Type PGA, ZIF (ZIP)
Subcategory PMIC - Power Management ICs
Pitch - Mating 0.050 (1.27mm)
Contact Finish - Post Gold
Contact Resistance --
Product Type Power Management Specialized - PMIC
Termination Post Length --
Pitch - Post 0.050 (1.27mm)
Features Open Frame
Product Category Power Management Specialized - PMIC
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish Thickness - Post 30.0µin (0.76µm)
Material Flammability Rating UL94 V-0
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