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MF1S5001XDUF，005 Tech Specifications

Category RFID, RF Access, Monitoring ICs
Manufacturer NXP
Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 11 (1 x 11)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Supplier Package WAFER
Category Mainstream Contactless Smart Card
Mounting Surface Mount
Operating Temperature --
Series 518
Packaging Bulk
Part Status Active
Termination Solder
Type SIP
Current Rating 3A
Pitch - Mating 0.100 (2.54mm)
Contact Finish - Post Gold
Contact Resistance --
Termination Post Length 0.125 (3.18mm)
Pitch - Post 0.100 (2.54mm)
Features Open Frame
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish Thickness - Post 10.0µin (0.25µm)
Material Flammability Rating UL94 V-0
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