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S25HL02GTDPBHV050 Tech Specifications

Category Memory
Manufacturer NXP
Contact Plating Lead, Tin
Voltage Rating (DC) 50 V
RoHS Compliant
Package Bulk
Mfr NXP Semiconductors
Product Status Active
Packaging Tape & Reel (TR)
Series -
Tolerance 1 %
Number of Terminations 2Terminations
Temperature Coefficient 200 ppm/°C
Resistance 1.62 Ω
Max Operating Temperature 155 °C
Min Operating Temperature -55 °C
Composition Thick Film
Power Rating 63 mW
Max Power Dissipation 63 mW
Case Code (Metric) 0402
Features Automotive AEC-Q200
Width 508 µm
Height 406.4 µm
Length 990.6 µm
Radiation Hardening No
Lead Free Contains Lead
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