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74LVC1G3157GW Tech Specifications

Category Interface - Analog Switches, Multiplexers, Demultiplexers
Manufacturer NXP
Surface Mount YES
Material aluminium
Number of Terminals 6Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOT-363
Package Description PLASTIC, SC-88, SOT-363, 6 PIN
On-state Resistance-Max (Ron) 38 Ω
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code VSSOP
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup) 2.7 V
Type of heatsink extruded
Heatsink shape round
Colour aluminium
Material finishing raw
Mounting heat transfer glue,
Internal diameter 30mm
Gross weight 700 g
JESD-609 Code e3
Pbfree Code Yes
Terminal Finish Tin (Sn)
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 6
JESD-30 Code R-PDSO-G6
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade AUTOMOTIVE
Supply Voltage-Min (Vsup) 1.65 V
Number of Channels 2Channels
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER
Seated Height-Max 1 mm
Supply Current-Max (Isup) 0.04 mA
Off-state Isolation-Nom 42 dB
Switching BREAK-BEFORE-MAKE
Switch-on Time-Max 6 ns
Switch-off Time-Max 5 ns
Signal Current-Max 0.05 A
2nd Connector Number of Positions Loaded LED
Saturation Current 1
Width 1.25 mm
Length 20mm
Diameter 46mm
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74LVC1G3157GW Documents

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