NXP Semiconductors 74LVC1G58GM Specialty Logic ICs
1Function
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74LVC1G58GM Tech Specifications
| Category | Logic - Specialty Logic | |
| Manufacturer | pSemi | |
| Surface Mount | YES | |
| Number of Terminals | 6Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SON | |
| Package Description | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 | |
| Load Capacitance (CL) | 50 pF | |
| Moisture Sensitivity Levels | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VSON | |
| Package Equivalence Code | SOLCC6,.04,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, VERY THIN PROFILE | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| JESD-609 Code | e3 | |
| Terminal Finish | Tin (Sn) | |
| HTS Code | 8542.39.00.01 |
| Packing Method | TR | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 6 | |
| JESD-30 Code | R-PDSO-N6 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Temperature Grade | AUTOMOTIVE | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Family | LVC/LCX/Z | |
| Seated Height-Max | 0.5 mm | |
| Logic IC Type | LOGIC CIRCUIT | |
| Max I(ol) | 0.024 A | |
| Prop. Delay@Nom-Sup | 7.9 ns | |
| Schmitt Trigger | YES | |
| Length | 1.45 mm | |
| Width | 1 mm |
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74LVC1G58GM Documents
Download datasheets and manufacturer documentation for 74LVC1G58GM
- DatasheetsPHGLS29662-1.pdf
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