74LVC2G17GW Tech Specifications

Category Logic - Gates and Inverters
Manufacturer pSemi
Surface Mount YES
Number of Terminals 6Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOT-363
Package Description PLASTIC, SC-88, SOT-363, SMT-6
Load Capacitance (CL) 50 pF
Moisture Sensitivity Levels 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP6,.08
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup) 1.8 V
JESD-609 Code e3
Pbfree Code Yes
Terminal Finish Tin (Sn)
HTS Code 8542.39.00.01
Packing Method TR
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 2Functions
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 6
JESD-30 Code R-PDSO-G6
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade AUTOMOTIVE
Supply Voltage-Min (Vsup) 1.65 V
Family LVC/LCX/Z
Number of Inputs 1Input
Seated Height-Max 1.1 mm
Logic IC Type BUFFER
Max I(ol) 0.024 A
Prop. Delay@Nom-Sup 7.1 ns
Propagation Delay (tpd) 13.1 ns
Schmitt Trigger YES
Length 2 mm
Width 1.25 mm
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74LVC2G17GW Documents

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