NXP Semiconductors BGS8L2 Telecom Interface ICs
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BGS8L2 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | pSemi | |
| Surface Mount | YES | |
| Number of Terminals | 6Terminals | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BCC, | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BCC | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER |
| Supply Voltage-Nom | 1.8 V | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BUTT | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.4 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PBCC-B6 | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 0.4 mm | |
| Telecom IC Type | RF FRONT END CIRCUIT | |
| Length | 1.1 mm | |
| Width | 0.7 mm |
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BGS8L2 Documents
Download datasheets and manufacturer documentation for BGS8L2
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