NXP Semiconductors LPC1756FBD80 MCU
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LPC1756FBD80 Tech Specifications
| Category | Embedded - Microcontrollers | |
| Manufacturer | pSemi | |
| Surface Mount | YES | |
| Number of Terminals | 80Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP80,.55SQ,20 | |
| Clock Frequency-Max | 12 MHz | |
| Moisture Sensitivity Levels | 2 | |
| Number of I/O Lines | 52I/O Lines | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP80,.55SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| RAM(byte) | 32768 | |
| ROM(word) | 262144 | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| JESD-609 Code | e3 | |
| Pbfree Code | Yes |
| ECCN Code | 3A991.A.2 | |
| Terminal Finish | TIN | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 80 | |
| JESD-30 Code | S-PQFP-G80 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Speed | 100 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | |
| Supply Current-Max | 100 mA | |
| Bit Size | 32 | |
| Has ADC | YES | |
| DMA Channels | YES | |
| PWM Channels | YES | |
| DAC Channels | YES | |
| Seated Height-Max | 1.6 mm | |
| On Chip Program ROM Width | 8 | |
| ROM Programmability | FLASH | |
| Length | 12 mm | |
| Width | 12 mm |
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LPC1756FBD80 Documents
Download datasheets and manufacturer documentation for LPC1756FBD80
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