NXP Semiconductors MC12311 Telecom Interface ICs
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MC12311 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | pSemi | |
| Surface Mount | YES | |
| Number of Terminals | 60Terminals | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 8 X 8 MM, 0.50 MM PITCH, LGA-60 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | VFLGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Supply Voltage-Nom | 3.3 V | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BUTT | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-XBGA-B60 | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 0.98 mm | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Length | 8 mm | |
| Width | 8 mm |
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