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MC68360CFE25 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer pSemi
Surface Mount YES
Number of Terminals 240Terminals
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP240,1.3SQ,20
Package Shape SQUARE
Package Style FLATPACK
Supply Voltage-Max 3.3 V
Supply Voltage-Min 2.7 V
Supply Voltage-Nom 3 V
Number of I/O Lines 46I/O Lines
Clock Frequency-Max 25 MHz
Package Description FQFP,
Ihs Manufacturer NXP SEMICONDUCTORS
Part Life Cycle Code Active
Additional Feature ALSO OPERATES AT 5 V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
JESD-30 Code S-CQFP-G240
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, LAN
Supply Current-Max 250 mA
Seated Height-Max 4.15 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
RAM (words) 2560
Number of Serial I/Os 4Serial I/Os
Bus Compatibility 68000
On Chip Data RAM Width 8
Data Transfer Rate-Max 10 MBps
Number of DMA Channels 2DMA Channels
Communication Protocol ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
Data Encoding/Decoding Method NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
Width 31.305 mm
Length 31.305 mm
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MC68360CFE25 Documents

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