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MC9S12XF256CLM Tech Specifications

Category Embedded - Microcontrollers
Manufacturer pSemi
Surface Mount YES
Number of Terminals 112Terminals
Number of I/O Lines 88I/O Lines
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LQFP
Package Equivalence Code QFP112,.87SQ
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE
RAM(byte) 20480
ROM(word) 262144
Supply Voltage-Max 1.98 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 1.8 V
Clock Frequency-Max 40 MHz
Date Of Intro 2016-03-07
Package Description LQFP,
Ihs Manufacturer NXP SEMICONDUCTORS
Part Life Cycle Code Active
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
JESD-30 Code S-PQFP-G112
Speed 50 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 110 mA
Bit Size 16
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 1.6 mm
Address Bus Width 10
On Chip Program ROM Width 8
CPU Family CPU12
Boundary Scan NO
Low Power Mode YES
External Data Bus Width 6
Format FIXED POINT
Integrated Cache NO
Number of Serial I/Os 5Serial I/Os
Number of Timers 2Timers
ROM Programmability FLASH
Number of External Interrupts 2External Interrupts
On Chip Data RAM Width 8
Length 20 mm
Width 20 mm
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