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MCM69R737AZP6 Tech Specifications

Category Memory
Manufacturer pSemi
Surface Mount YES
Number of Terminals 119Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description BGA,
Access Time-Max 3 ns
Number of Words 131072 wordsWord
Number of Words Code 128000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Supply Voltage-Nom (Vsup) 3.3 V
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B119
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 3.15 V
Operating Mode SYNCHRONOUS
Organization 128KX36
Seated Height-Max 2.4 mm
Memory Width 36
Memory Density 4718592 bit
Parallel/Serial PARALLEL
Memory IC Type LATE-WRITE SRAM
Length 22 mm
Width 14 mm
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MCM69R737AZP6 Documents

Download datasheets and manufacturer documentation for   MCM69R737AZP6

  • Datasheets
MCM69R737AZP6 brand manufacturers: NXP Semiconductors, Elecinsight stock, MCM69R737AZP6 reference price.NXP Semiconductors. MCM69R737AZP6 parameters, MCM69R737AZP6 Datasheet PDF and pin diagram description download.You can use the MCM69R737AZP6 Memory, DSP Datesheet PDF, find MCM69R737AZP6 pin diagram and circuit diagram and usage method of function,MCM69R737AZP6 electronics tutorials.You can download from the Elecinsight.