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MK60DN512ZVMD10R Tech Specifications

Category Embedded - Microcontrollers
Manufacturer pSemi
Surface Mount YES
Number of Terminals 144Terminals
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description LFBGA, BGA144,12X12,40
Clock Frequency-Max 32 MHz
Number of I/O Lines 104I/O Lines
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
RAM(byte) 131072
ROM(word) 524288
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B144
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Speed 100 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Supply Current-Max 87 mA
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
Seated Height-Max 1.7 mm
On Chip Program ROM Width 8
CPU Family CORTEX-M4
ROM Programmability FLASH
Length 13 mm
Width 13 mm
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