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P1025NSE5DFB Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer pSemi
Factory Lead Time 4 Weeks
Surface Mount YES
Number of Terminals 561Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description BGA-561
Moisture Sensitivity Levels 3
Operating Temperature-Max 125 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA561,27X27,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V
Pbfree Code Yes
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B561
uPs/uCs/Peripheral ICs Type SoC
Seated Height-Max 2.3 mm
Length 23 mm
Width 23 mm
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P1025NSE5DFB Documents

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