P89C52UBPN Tech Specifications

Category Embedded - Microcontrollers
Manufacturer pSemi
Surface Mount NO
Number of Terminals 40Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP,
Clock Frequency-Max 33 MHz
Number of I/O Lines 32I/O Lines
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 40
JESD-30 Code R-PDIP-T40
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Speed 33 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Bit Size 8
Has ADC NO
DMA Channels NO
PWM Channels NO
DAC Channels NO
Seated Height-Max 4.7 mm
Address Bus Width 16
External Data Bus Width 8
ROM Programmability FLASH
Length 52 mm
Width 15.24 mm
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P89C52UBPN Documents

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