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PDIUSBH11NB Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer pSemi
Surface Mount NO
Number of Terminals 32Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code DIP
Package Description 0.400 INCH, SHRINK, PLASTIC, SOT-232-1, DIP-32
Clock Frequency-Max 48 MHz
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code SDIP
Package Equivalence Code SDIP32,.4
Package Shape RECTANGULAR
Package Style IN-LINE, SHRINK PITCH
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 1.778 mm
Reach Compliance Code compliant
Pin Count 32
JESD-30 Code R-PDIP-T32
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, UNIVERSAL SERIAL BUS
Seated Height-Max 4.7 mm
Bus Compatibility I2C
Data Transfer Rate-Max 1.5 MBps
Length 28.95 mm
Width 10.16 mm
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PDIUSBH11NB Documents

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