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PLUS173BN Tech Specifications

Category Embedded - PLDs (Programmable Logic Device)
Manufacturer pSemi
Surface Mount NO
Number of Terminals 24Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP24,.3
Number of I/O Lines 10I/O Lines
Operating Temperature-Max 75 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V
Additional Feature PROGRAMMABLE OUTPUT POLARITY
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 24
JESD-30 Code R-PDIP-T24
Number of Outputs 10Outputs
Qualification Status Not Qualified
Temperature Grade COMMERCIAL EXTENDED
Propagation Delay 15 ns
Architecture PLA-TYPE
Number of Inputs 22Inputs
Organization 12 DEDICATED INPUTS, 10 I/O
Seated Height-Max 4.7 mm
Programmable Logic Type OT PLD
Output Function COMBINATORIAL
Number of Dedicated Inputs 12Dedicated Inputs
Number of Product Terms 42Product Terms
Length 31.7 mm
Width 7.62 mm
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PLUS173BN Documents

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