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PN5321A3HN/C106 Tech Specifications

Category Interface - Telecom
Manufacturer NXP
Contact plating gold-plated
Surface Mount YES
Number of pins 10pins
Number of Terminals 40Terminals
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 2x5
Row pitch 2.54mm
Gross weight 0.35 g
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFN
Package Description HVQCCN,
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Operating temperature -40...163°C
JESD-609 Code e4
ECCN Code EAR99
Terminal Finish NICKEL PALLADIUM GOLD
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Current rating 1.5A
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 40
JESD-30 Code S-PQCC-N40
Temperature Grade OTHER
Seated Height-Max 1 mm
Telecom IC Type TELECOM CIRCUIT
Rated voltage 60V
Profile beryllium copper
Saturation Current 2
Length 6 mm
Width 6 mm
Plating thickness 0.254µm
Flammability rating UL94V-0
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PN5321A3HN/C106 Documents

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