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PZ3064DS10EC Tech Specifications

Category Embedded - PLDs (Programmable Logic Device)
Manufacturer pSemi
Surface Mount YES
Number of Terminals 56Terminals
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description LFBGA,
Clock Frequency-Max 90 MHz
Number of I/O Lines 44I/O Lines
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA56,10X10,20
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2.7 V
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B56
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Propagation Delay 11.5 ns
Organization 2 DEDICATED INPUTS, 44 I/O
Seated Height-Max 1.35 mm
Programmable Logic Type EE PLD
Output Function MACROCELL
Number of Dedicated Inputs 2Dedicated Inputs
Length 6 mm
Width 6 mm
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PZ3064DS10EC Documents

Download datasheets and manufacturer documentation for   PZ3064DS10EC

  • Datasheets
PZ3064DS10EC brand manufacturers: NXP Semiconductors, Elecinsight stock, PZ3064DS10EC reference price.NXP Semiconductors. PZ3064DS10EC parameters, PZ3064DS10EC Datasheet PDF and pin diagram description download.You can use the PZ3064DS10EC Embedded - PLDs (Programmable Logic Device), DSP Datesheet PDF, find PZ3064DS10EC pin diagram and circuit diagram and usage method of function,PZ3064DS10EC electronics tutorials.You can download from the Elecinsight.