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S9S12XS128J1MAE

Embedded - Microcontrollers
pSemi
Factory Lead Time 16 Weeks
Surface Mount YES
Number of Terminals 64Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, MS-026BCD, LQFP-64
Clock Frequency-Max 40 MHz
Moisture Sensitivity Levels 3
Number of I/O Lines 44I/O Lines
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Supply Voltage-Nom 1.8 V
Supply Voltage-Min 1.72 V
Supply Voltage-Max 1.98 V
ROM(word) 131072
RAM(byte) 8192
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Package Shape SQUARE
Package Equivalence Code QFP64,.47SQ,20
Package Code LFQFP
Package Body Material PLASTIC/EPOXY
JESD-609 Code e3
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
Speed 40 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Bit Size 16
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels YES
Seated Height-Max 1.6 mm
On Chip Program ROM Width 8
CPU Family CPU12
Screening Level AEC-Q100
ROM Programmability FLASH
Length 10 mm
Width 10 mm
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