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S9S12XS256J0MAE Tech Specifications

Category Embedded - Microcontrollers
Manufacturer pSemi
Factory Lead Time 16 Weeks
Surface Mount YES
Number of Terminals 64Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Clock Frequency-Max 16 MHz
Moisture Sensitivity Levels 3
Number of I/O Lines 44I/O Lines
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC
Package Code LFQFP
Package Equivalence Code QFP64,.47SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
RAM(byte) 12288
ROM(word) 262144
Supply Voltage-Max 1.98 V
Supply Voltage-Min 1.72 V
Supply Voltage-Nom 1.8 V
JESD-609 Code e3
ECCN Code 3A991.A.2
Terminal Finish Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
Speed 40 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Supply Current-Max 35 mA
Bit Size 16
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
On Chip Program ROM Width 8
CPU Family CPU12
Boundary Scan NO
Screening Level AEC-Q100
ROM Programmability FLASH
Length 10 mm
Width 10 mm
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