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SC16C852SVIET Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer pSemi
Surface Mount YES
Number of Terminals 36Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code BGA
Package Description TFBGA,
Manufacturer Package Code SOT-912-1
Clock Frequency-Max 80 MHz
Moisture Sensitivity Levels 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Max 1.95 V
Supply Voltage-Min 1.65 V
Supply Voltage-Nom 1.8 V
JESD-609 Code e1
Pbfree Code Yes
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 36
JESD-30 Code S-PBGA-B36
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Seated Height-Max 1.15 mm
Address Bus Width 8
Boundary Scan NO
Low Power Mode YES
External Data Bus Width 8
Number of Serial I/Os 2Serial I/Os
Data Transfer Rate-Max 0.0000012122176018 MBps
Communication Protocol ASYNC, BIT
Data Encoding/Decoding Method NRZ
Length 3.5 mm
Width 3.5 mm
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