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SPC5561F2MVZ132 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer pSemi
Surface Mount YES
Number of Terminals 324Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Clock Frequency-Max 40 MHz
Moisture Sensitivity Levels 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
RAM(byte) 196608
ROM(word) 1048576
Supply Voltage-Max 1.65 V
Supply Voltage-Min 1.35 V
Supply Voltage-Nom 1.5 V
JESD-609 Code e1
ECCN Code 3A991.A.2
Terminal Finish TIN SILVER COPPER
Additional Feature ADC 40-CH IS AVAILABLE
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
Speed 132 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Supply Current-Max 670 mA
Bit Size 32
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 2.55 mm
Address Bus Width 20
On Chip Program ROM Width 8
CPU Family E200
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Format FLOATING POINT
Integrated Cache YES
ROM Programmability FLASH
On Chip Data RAM Width 8
Length 23 mm
Width 23 mm
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SPC5561F2MVZ132 Documents

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  • Datasheets
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