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NXP Semiconductors TEA1062AT/C4 Telecom Interface ICs
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TEA1062AT/C4 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | pSemi | |
| Surface Mount | YES | |
| Number of Terminals | 16Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SOIC | |
| Package Description | SOP, | |
| Moisture Sensitivity Levels | 1 | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Supply Voltage-Nom | 2.7 V | |
| JESD-609 Code | e4 |
| Pbfree Code | Yes | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Pin Count | 16 | |
| JESD-30 Code | R-PDSO-G16 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Seated Height-Max | 1.75 mm | |
| Telecom IC Type | TELEPHONE SPEECH CIRCUIT | |
| Length | 9.9 mm | |
| Width | 3.9 mm |
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TEA1062AT/C4 Documents
Download datasheets and manufacturer documentation for TEA1062AT/C4
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