NXP Semiconductors TEA1067/C2 Telecom Interface ICs
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TEA1067/C2 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | pSemi | |
| Surface Mount | NO | |
| Number of Terminals | 18Terminals | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Supply Voltage-Nom | 2.8 V |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 18 | |
| JESD-30 Code | R-PDIP-T18 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Seated Height-Max | 4.7 mm | |
| Telecom IC Type | TELEPHONE SPEECH CIRCUIT | |
| Length | 21.6 mm | |
| Width | 7.62 mm |
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TEA1067/C2 Documents
Download datasheets and manufacturer documentation for TEA1067/C2
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