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TEA1118M/C2 Tech Specifications

Category Serial Device Servers
Manufacturer pSemi
Surface Mount YES
Number of Terminals 16Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description PLASTIC, SOT-369, SSOP-16
Operating Temperature-Max 75 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code LSSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Supply Voltage-Nom 2.9 V
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Pin Count 16
JESD-30 Code R-PDSO-G16
Qualification Status Not Qualified
Temperature Grade COMMERCIAL EXTENDED
Supply Current-Max 1.4 mA
Seated Height-Max 1.5 mm
Telecom IC Type CORDLESS TELEPHONE BASEBAND CIRCUIT
Length 5.2 mm
Width 4.4 mm
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TEA1118M/C2 Documents

Download datasheets and manufacturer documentation for   TEA1118M/C2

TEA1118M/C2 brand manufacturers: NXP Semiconductors, Elecinsight stock, TEA1118M/C2 reference price.NXP Semiconductors. TEA1118M/C2 parameters, TEA1118M/C2 Datasheet PDF and pin diagram description download.You can use the TEA1118M/C2 Serial Device Servers, DSP Datesheet PDF, find TEA1118M/C2 pin diagram and circuit diagram and usage method of function,TEA1118M/C2 electronics tutorials.You can download from the Elecinsight.