NXP Semiconductors TFF11092HN Telecom Interface ICs
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TFF11092HN Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | pSemi | |
| Surface Mount | YES | |
| Number of Terminals | 24Terminals | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-1, HVQFN-24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Supply Voltage-Nom | 3.3 V | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PQCC-N24 | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 1 mm | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Length | 4 mm | |
| Width | 4 mm |
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TFF11092HN Documents
Download datasheets and manufacturer documentation for TFF11092HN
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