TJA1027TK/20 Tech Specifications

Category Interface - Telecom
Manufacturer NXP
Surface Mount YES
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SON
Package Description 3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, MO-229, SOT782-1, HVSON-8
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Shape SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Supply Voltage-Nom 12 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x4
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
JESD-30 Code S-PDSO-N8
Seated Height-Max 1 mm
Telecom IC Type INTERFACE CIRCUIT
Profile beryllium copper
Saturation Current 1
Length 3 mm
Width 3 mm
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