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- TJA1027TK/20
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TJA1027TK/20 Tech Specifications
Category | Interface - Telecom | |
Manufacturer | NXP | |
Surface Mount | YES | |
Number of Terminals | 8Terminals | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SON | |
Package Description | 3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, MO-229, SOT782-1, HVSON-8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Supply Voltage-Nom | 12 V | |
Type of connector | pin strips | |
Connector | socket | |
Kind of connector | female | |
Spatial orientation | straight | |
Contacts pitch | 2.54mm |
Electrical mounting | THT | |
Connector pinout layout | 1x4 | |
HTS Code | 8542.39.00.01 | |
Terminal Position | DUAL | |
Terminal Form | NO LEAD | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Terminal Pitch | 0.65 mm | |
Reach Compliance Code | compliant | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Pin Count | 8 | |
JESD-30 Code | S-PDSO-N8 | |
Seated Height-Max | 1 mm | |
Telecom IC Type | INTERFACE CIRCUIT | |
Profile | beryllium copper | |
Saturation Current | 1 | |
Length | 3 mm | |
Width | 3 mm |
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TJA1027TK/20 Documents
Download datasheets and manufacturer documentation for TJA1027TK/20
- Datasheetsb3eb57b00186ace307f379093dfe1c96.pdf
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