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- TJA1027TK/20
NXP Semiconductors TJA1027TK/20 Telecom Interface ICs
DUAL
IN STOCK
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Mult. : 1
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TJA1027TK/20 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | pSemi | |
| Surface Mount | YES | |
| Number of Terminals | 8Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SON | |
| Package Description | 3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, MO-229, SOT782-1, HVSON-8 | |
| Moisture Sensitivity Levels | 1 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Supply Voltage-Nom | 12 V |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.65 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 8 | |
| JESD-30 Code | S-PDSO-N8 | |
| Seated Height-Max | 1 mm | |
| Telecom IC Type | INTERFACE CIRCUIT | |
| Length | 3 mm | |
| Width | 3 mm |
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