NXP USA Inc. BA591,115 RF Diodes
-65°C~150°C TJ
IN STOCK
: 120000
Min. : 1
Mult. : 1
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BA591,115 Tech Specifications
| Category | Diodes - RF | |
| Manufacturer | NXP | |
| Factory Lead Time | 8 Weeks | |
| Package / Case | SC-76, SOD-323 | |
| Surface Mount | YES | |
| Diode Element Material | SILICON | |
| Number of Elements | 1 Element | |
| Power Dissipation (Max) | 500mW | |
| Operating Temperature | -65°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Published | 1995 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| Terminal Finish | Tin (Sn) | |
| HTS Code | 8541.10.00.70 |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | BA591 | |
| Pin Count | 2 | |
| JESD-30 Code | R-PDSO-G2 | |
| Qualification Status | Not Qualified | |
| Diode Type | Standard - Single | |
| Capacitance @ Vr, F | 0.9pF @ 3V 1MHz | |
| Voltage - Peak Reverse (Max) | 35V | |
| Frequency Band | VERY HIGH FREQUENCY | |
| Diode Capacitance-Nom | 0.8pF | |
| Resistance @ If, F | 500mOhm @ 10mA 100MHz | |
| Diode Capacitance-Max | 1.05pF | |
| RoHS Status | ROHS3 Compliant |
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BA591,115 Documents
Download datasheets and manufacturer documentation for BA591,115
- DatasheetsBA591
- PCN PackagingLighter Reels 02/Jan/2014 Carrier Tape Chg 26/Jul/2016
- Environmental InformationNXP RoHS3 Cert
- PCN Design/SpecificationResin Hardener 02/Jul/2013
- PCN Assembly/OriginWafer Fab Update 15/Dec/2014
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