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FS32V232BMN1VUB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 22 Weeks
Package / Case 621-FBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TA
Packaging Tray
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 621Terminations
ECCN Code 5A992
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B621
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Speed 800MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A53, Cortex®-M4
Bit Size 64
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V
Ethernet GbE
Number of Cores/Bus Width 4 Core 64-Bit/1 Core 32-Bit
Graphics Acceleration No
RAM Controllers LPDDR2, DDR3, DDR3L
Additional Interfaces I2C, SPI, PCI, UART
Co-Processors/DSP Multimedia; NEON™ MPE
Security Features AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Display & Interface Controllers LCD, Video
Length 17mm
Height Seated (Max) 2.44mm
RoHS Status ROHS3 Compliant
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