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LS1020AXE7HNB

Embedded - Microprocessors
NXP
Factory Lead Time 18 Weeks
Package / Case 525-FBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~105°C
Packaging Tray
Series QorIQ® Layerscape
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 525Terminations
ECCN Code 5A002.A.1
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B525
Supply Voltage-Max (Vsup) 1.03V
Supply Voltage-Min (Vsup) 0.97V
Speed 800MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A7
Clock Frequency 133.3MHz
Bit Size 32
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Ethernet GbE (3)
Number of Cores/Bus Width 2 Core 32-Bit
RAM Controllers DDR3L, DDR4
USB USB 2.0 (1), USB 3.0 + PHY
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features Secure Boot, TrustZone®
SATA SATA 3Gbps (1)
Length 19mm
Height Seated (Max) 2.07mm
RoHS Status ROHS3 Compliant
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LS1020AXE7HNB

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