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LS1021AXE7KQB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 18 Weeks
Package / Case 525-FBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~105°C
Packaging Tray
Series QorIQ® Layerscape
Published 2002
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 525Terminations
ECCN Code 5A002.A.1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B525
Supply Voltage-Max (Vsup) 1.03V
Supply Voltage-Min (Vsup) 0.97V
Speed 1.0GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor ARM® Cortex®-A7
Ethernet GbE (3)
Number of Cores/Bus Width 2 Core 32-Bit
RAM Controllers DDR3L, DDR4
USB USB 3.0 (1) + PHY
Security Features Secure Boot, TrustZone®
Display & Interface Controllers 2D-ACE
SATA SATA 6Gbps (1)
Length 19mm
Height Seated (Max) 2.07mm
RoHS Status ROHS3 Compliant
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