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LS1046AXN8T1A Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 18 Weeks
Package / Case 780-FBGA, FCBGA
Surface Mount YES
Number of I/Os 76I/Os
Operating Temperature -40°C~105°C
Packaging Tray
Series QorIQ® Layerscape
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780Terminations
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B780
Supply Voltage-Max (Vsup) 1.03V
Supply Voltage-Min (Vsup) 0.97V
Speed 1.8GHz
Core Processor ARM® Cortex®-A72
Address Bus Width 14
Boundary Scan YES
External Data Bus Width 64
Ethernet 10GbE (2), 2.5GbE (1), 1GbE (4)
Number of Cores/Bus Width 4 Core 64-Bit
RAM Controllers DDR4
USB USB 3.0 (3) + PHY
Bus Compatibility I2C, PCI, SPI, UART, USB
Security Features Secure Boot, TrustZone®
SATA SATA 6Gbps (1)
Length 23mm
Height Seated (Max) 2.61mm
RoHS Status ROHS3 Compliant
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