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MC33PF8100A0ES Tech Specifications
| Category | PMIC - Power Management - Specialized | |
| Manufacturer | NXP | |
| Factory Lead Time | 8 Weeks | |
| Mounting Type | Surface Mount, Wettable Flank | |
| Package / Case | 56-VFQFN Exposed Pad | |
| Usage Level | Automotive grade | |
| Operating Temperature | -40°C~105°C TA | |
| Packaging | Tray |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Applications | High Performance i.MX 8, S32x Processor Based | |
| Voltage - Supply | 2.5V~5.5V | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT | |
| RoHS Status | ROHS3 Compliant |
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MC33PF8100A0ES Documents
Download datasheets and manufacturer documentation for MC33PF8100A0ES
- DatasheetsPF8100, PF8200
- PCN PackagingMult Dev ShipBox Chg 14/Feb/2022
- PCN Design/SpecificationPF8100-PF8200 21/Nov/2019
- Environmental InformationNXP RoHS3 Cert
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