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MC68EN360AI25L Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 8 Weeks
Package / Case 240-BFQFP
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series M683xx
Published 1995
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 240Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68EN360
JESD-30 Code S-PQFP-G240
Speed 25MHz
uPs/uCs/Peripheral ICs Type RISC MICROCONTROLLER
Core Processor CPU32+
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
RoHS Status ROHS3 Compliant
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