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MC68EN360AI33L Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Package / Case 240-BFQFP
Surface Mount YES
Number of I/Os 46I/Os
Operating Temperature 0°C~70°C TA
Packaging Tray
Series M683xx
Published 1995
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 240Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68EN360
JESD-30 Code S-PQFP-G240
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Speed 33MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor CPU32+
Clock Frequency 6MHz
Bit Size 32
Has ADC NO
DMA Channels YES
PWM Channels NO
Address Bus Width 32
External Data Bus Width 32
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
Length 31.305mm
Height Seated (Max) 4.15mm
RoHS Status ROHS3 Compliant
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