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MC68EN360VR33L Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 8 Weeks
Package / Case 357-BBGA
Surface Mount YES
Number of I/Os 46I/Os
Operating Temperature 0°C~70°C TA
Packaging Tray
Series M683xx
Published 1995
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68EN360
JESD-30 Code S-PBGA-B357
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Speed 33MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor CPU32+
Clock Frequency 6MHz
Bit Size 32
Has ADC NO
DMA Channels YES
PWM Channels NO
Address Bus Width 32
External Data Bus Width 32
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
Length 25mm
Height Seated (Max) 1.86mm
RoHS Status ROHS3 Compliant
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MC68EN360VR33L Documents

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